| Kantite lòd | ≥1PCS |
| Kalite Klas | IPC-A-610 |
| Tan plon | 48H pou rapid; |
| 4-5 jou pou pwototip; | |
| Lòt kantite bay lè site | |
| Gwosè | 50 * 50mm-510 * 460mm |
| Kalite Komisyon Konsèy | Rijid |
| Fleksib | |
| Rijid-fleksib | |
| Nwayo metal | |
| Pake Min | 01005 (0.4mm * 0.2mm) |
| Montaj Presizyon | ±0.035mm(±0.025mm)Cpk≥1.0 |
| Sifas fini | Plon/Plon GRATIS HASL, Immersion lò, OSP, elatriye |
| Kalite Asanble | THD (Aparèy Thru-hole) / Konvansyonèl |
| SMT (Teknoloji sifas mòn) | |
| SMT & THD melanje | |
| Double-sided SMT ak / oswa THD asanble | |
| Konpozan Sourcing | En (Tout konpozan ki soti nan ANKE), yon pati nan kle, Konsigne |
| Pake BGA | BGA Dia 0.14mm, BGA 0.2MM Pitch |
| Emballage konpozan | Bobin, Koupe tep, Tib, Plato, Pati ki lach |
| Asanble kab | Custom câbles, asanble kab, fil elektrik / ekipay |
| Stencil | Stencil ak oswa san ankadreman |
| Fòma fichye konsepsyon | Gerber RS-274X, 274D, Eagle ak DXF AutoCAD a, DWG |
| BOM (Bal of Materials) | |
| Chwazi epi mete dosye (XYRS) | |
| Enspeksyon Kalite | Enspeksyon radyografi, |
| AOI (Otomatik Optical Enspektè), | |
| Tès fonksyonèl (modil tès yo dwe apwovizyone) | |
| Burn-in tès | |
| Kapasite SMT | 3 Milyon-4 Milyon pad soude / jou |
| Kapasite DIP | 100 mil PIN/jou |
Tan pòs: Sep-05-2022
